Patent Assignment Details
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| Reel/Frame: | 037186/0902 | |
| Pages: | 2 |
| | Recorded: | 12/02/2015 | | |
| Attorney Dkt #: | 50138-P004D1C1 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14287603
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/18/2014
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Title:
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LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD
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Assignee
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| UNIT E, 9TH FLOOR METEX HOUSE |
| 28 FUI YIU KOK STREET |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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WINSTEAD PC
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P.O. BOX 131851
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DALLAS, TX 75313
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