Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018996/0903 | |
| Pages: | 4 |
| | Recorded: | 03/12/2007 | | |
| Attorney Dkt #: | 010549-0359379 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2011
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Application #:
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11685085
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Filing Dt:
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03/12/2007
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Publication #:
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Pub Dt:
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09/18/2008
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Title:
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METHOD OF MAKING RELIABLE WAFER LEVEL CHIP SCALE PACKAGE SEMICONDUCTOR DEVICES
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Assignee
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| 490 N. MCCARTHY BOULEVARD |
| SUITE 100 |
| MILPITAS, CALIFORNIA 95035 |
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Correspondence name and address
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DAVID A. JAKOPIN
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P.O. BOX 10500
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PILLSBURY WINTHROP SHAW PITTMAN LLP
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MCLEAN, VA 22102
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