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Total properties:
17
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09080264
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Filing Dt:
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05/18/1998
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Title:
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ELECTROCHEMICAL MACHINING USING MODULATED REVERSE ELECTRIC FIELDS
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09172299
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Filing Dt:
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10/14/1998
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Title:
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PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
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Patent #:
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Issue Dt:
|
04/24/2001
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Application #:
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09200959
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Filing Dt:
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11/30/1998
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Title:
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REMOVAL OF SACRIFICIAL CORES BY ELECTROCHEMICAL MACHINING
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Patent #:
|
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Issue Dt:
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04/03/2001
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Application #:
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09239811
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Filing Dt:
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01/29/1999
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Title:
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ELECTRODEPOSITION OF METALS IN SMALL RECESSES FOR MANUFACTURE OF HIGH DENSITY INTERCONNECTS USING REVERSE PULS PLATING
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Patent #:
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Issue Dt:
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10/30/2001
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Application #:
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09419881
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Filing Dt:
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10/18/1999
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Title:
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SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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Patent #:
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Issue Dt:
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10/16/2001
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Application #:
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09553616
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Filing Dt:
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04/20/2000
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Title:
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Electrodeposition of metals in small recesses using modulated electric fields
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Patent #:
|
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Issue Dt:
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11/20/2001
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Application #:
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09553623
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Filing Dt:
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04/20/2000
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Title:
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Pulse reverse electrodeposition for metallization and planarization of semiconductor substrates
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09688377
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Filing Dt:
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10/17/2000
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Title:
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ELECTRODEPOSITION OF METALS FOR FORMING THREE-DIMENSIONAL MICROSTRUCTURES
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Patent #:
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Issue Dt:
|
05/06/2003
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Application #:
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09688378
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Filing Dt:
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10/17/2000
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Title:
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SEQUENTIAL ELECTROMACHINING AND ELECTROPOLISHING OF METALS AND THE LIKE USING MODULATED ELECTRIC FIELDS
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|
|
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Patent #:
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Issue Dt:
|
02/25/2003
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Application #:
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09823749
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Filing Dt:
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04/03/2001
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Publication #:
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Pub Dt:
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05/16/2002
| | | | |
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Title:
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ELECTRODEPOSITION OF METALS IN SMALL RECESSES USING MODULATED ELECTRIC FIELDS
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|
|
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Patent #:
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|
Issue Dt:
|
03/08/2005
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Application #:
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09823750
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Filing Dt:
|
04/03/2001
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Publication #:
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Pub Dt:
|
04/04/2002
| | | | |
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Title:
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SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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Patent #:
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Issue Dt:
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04/12/2005
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Application #:
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09823751
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Filing Dt:
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04/03/2001
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Publication #:
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Pub Dt:
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03/21/2002
| | | | |
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Title:
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PULSE REVERSE ELECTRODEPOSITION FOR METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/13/2004
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Application #:
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09856974
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Filing Dt:
|
05/30/2001
|
|
Title:
|
REMOVAL OF SACRIFICIAL CORES BY ELECTROCHEMICAL MACHINING
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|
|
|
|
Patent #:
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|
Issue Dt:
|
12/07/2004
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Application #:
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09975974
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Filing Dt:
|
10/15/2001
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Publication #:
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|
Pub Dt:
|
04/24/2003
| | | | |
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Title:
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ELECTRODEPOSITION OF METALS IN HIGH-ASPECT RATIO CAVITIES USING MODULATED REVERSE ELECTRIC FIELDS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/25/2003
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Application #:
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10132399
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Filing Dt:
|
04/26/2002
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|
Publication #:
|
|
Pub Dt:
|
01/16/2003
| | | | |
|
Title:
|
SEQUENTIAL ELECTRODEPOSITION OF METALS USING MODULATED ELECTRIC FIELDS FOR MANUFACTURE OF CIRCUIT BOARDS HAVING FEATURES OF DIFFERENT SIZES
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/15/2004
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Application #:
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10367600
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Filing Dt:
|
02/14/2003
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Publication #:
|
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Pub Dt:
|
09/25/2003
| | | | |
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Title:
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METHOD FOR ELECTROCHEMICAL METALLIZATION AND PLANARIZATION OF SEMICONDUCTOR SUBSTRATES HAVING FEATURES OF DIFFERENT SIZES
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|
|
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Patent #:
|
|
Issue Dt:
|
04/04/2006
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Application #:
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10459105
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Filing Dt:
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06/11/2003
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Publication #:
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Pub Dt:
|
01/08/2004
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Title:
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ELECTROLYTIC ETCHING OF METAL LAYERS
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|
