Patent Assignment Details
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| Reel/Frame: | 042330/0905 | |
| Pages: | 3 |
| | Recorded: | 05/10/2017 | | |
| Attorney Dkt #: | 16SKY0394.01 US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/06/2019
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Application #:
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15371315
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Filing Dt:
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12/07/2016
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Publication #:
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Pub Dt:
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06/08/2017
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Title:
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METHOD OF PROVIDING PROTECTIVE CAVITY AND INTEGRATED PASSIVE COMPONENTS IN WAFER LEVEL CHIP SCALE PACKAGE USING A CARRIER WAFER
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Assignee
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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Correspondence name and address
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DONALD BOLLELLA
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5221 CALIFORNIA AVENUE, 21-1
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IRVINE, CA 92617
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