Patent Assignment Details
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| Reel/Frame: | 016081/0907 | |
| Pages: | 7 |
| | Recorded: | 06/01/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/11/2007
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Application #:
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10976601
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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09/22/2005
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Title:
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SEMICONDUCTOR CHIP PACKAGING METHOD WITH INDIVIDUALLY PLACED FILM ADHESIVE PIECES
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Assignee
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| 47400 KATO ROAD |
| FREMONT, CALIFORNIA 94538 |
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Correspondence name and address
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BILL KENNEDY, HAYNES BEFFEL & WOLFELD
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P.O. BOX 366
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HALF MOON BAY, CA 94019
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