Patent Assignment Details
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| Reel/Frame: | 040595/0912 | |
| Pages: | 4 |
| | Recorded: | 12/08/2016 | | |
| Attorney Dkt #: | 1030681-001133 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/20/2018
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Application #:
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15311038
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Filing Dt:
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11/14/2016
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Publication #:
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Pub Dt:
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03/23/2017
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Title:
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LASER PROCESSING METHOD FOR CUTTING SEMICONDUCTOR WAFER HAVING METAL LAYER FORMED THEREON AND LASER PROCESSING DEVICE
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Assignee
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| 91 DONGPYEON-RO, DONGAN-GU |
| ANYANG-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 431-815 |
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Correspondence name and address
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BUCHANAN, INGERSOLL & ROONEY PC
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POST OFFICE BOX 1404
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ALEXANDRIA, VA 22313-1404
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