Patent Assignment Details
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| Reel/Frame: | 014118/0915 | |
| Pages: | 3 |
| | Recorded: | 11/11/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/09/2005
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Application #:
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10606429
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Filing Dt:
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06/25/2003
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Publication #:
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Pub Dt:
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12/30/2004
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE FOR A DIE LARGER THAN A DIE PAD
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Assignee
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| 5 YISHUN ST. 23 |
| SINGAPORE 768442, SINGAPORE |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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STE. A1
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SUNNYVALE, CA 94087
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