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Patent Assignment Details
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Reel/Frame:015355/0918   Pages: 17
Recorded: 05/26/2004
Conveyance: SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
09/16/1997
Application #:
08627542
Filing Dt:
04/04/1996
Title:
LOW FRICTION SOLDER ELECTRODEPOSITS
2
Patent #:
Issue Dt:
12/29/1998
Application #:
08833009
Filing Dt:
04/04/1997
Title:
LOW FRICTION, DUCTILE, MULTILAYER ELECTRODEPOSITS
3
Patent #:
Issue Dt:
06/29/2004
Application #:
10015500
Filing Dt:
12/11/2001
Publication #:
Pub Dt:
02/20/2003
Title:
BARRIER LAYER FOR ELECTRICAL CONNECTORS AND METHODS OF APPLYING THE LAYER
Assignor
1
Exec Dt:
03/31/2004
Assignee
1
1133 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036
Correspondence name and address
OTTERBOURG, STEINDLER, HOUSTON ET AL
TRACEY D. BENNETT
230 PARK AVENUE
NEW YORK, NY 10169

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