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Reel/Frame:045531/0919   Pages: 9
Recorded: 04/13/2018
Attorney Dkt #:67707-227
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 3
1
Patent #:
Issue Dt:
08/18/2009
Application #:
11669160
Filing Dt:
01/31/2007
Publication #:
Pub Dt:
05/01/2008
Title:
BONDING STRUCTURE
2
Patent #:
Issue Dt:
08/31/2010
Application #:
11954082
Filing Dt:
12/11/2007
Publication #:
Pub Dt:
04/09/2009
Title:
METHOD OF FABRICATING THIN FILM TRANSISTOR
3
Patent #:
Issue Dt:
07/03/2012
Application #:
12486771
Filing Dt:
06/18/2009
Publication #:
Pub Dt:
10/08/2009
Title:
METHOD OF FABRICATING BONDING STRUCTURE
Assignors
1
Exec Dt:
01/02/2018
2
Exec Dt:
03/16/2018
3
Exec Dt:
12/04/2017
4
Exec Dt:
12/20/2017
5
Exec Dt:
01/12/2018
6
Exec Dt:
01/22/2018
Assignee
1
NO. 1, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN
Correspondence name and address
WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS
8230 BOONE BLVD, SUITE 405
VIENNA, VA 22182

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