Patent Assignment Details
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| Reel/Frame: | 013677/0923 | |
| Pages: | 4 |
| | Recorded: | 05/16/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/28/2004
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Application #:
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10249910
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Filing Dt:
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05/16/2003
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Title:
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HEAT DISSIPATION FROM IC INTERCONNECTS
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM MICROELECTRONICS
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INTELLECTUAL PROPERTY LAW
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1000 RIVER STREET
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972 E
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ESSEX JUNCTION, VT 05452
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