Patent Assignment Details
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Reel/Frame: | 016013/0924 | |
| Pages: | 2 |
| | Recorded: | 04/05/2005 | | |
Conveyance: | AGREEMENT (SEE THE DOCUMENT FOR DETAILS) |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10979212
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Filing Dt:
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11/03/2004
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Publication #:
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Pub Dt:
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07/28/2005
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Title:
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Method of conditioning polishing pad for semiconductor wafer
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Assignees
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3-2970-53, MIHARA-CHO |
TOKORAZAWA-SHI, SAITAMA, JAPAN |
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5050 SHINDENBORA, ASAHIMAE-CHO |
OWARIASAHI-SHI, AICHI, JAPAN |
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Correspondence name and address
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DAVID S. SAFRAN, ESQ.
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NIXON PEABODY LLP
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SUITE 900
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401 9TH STREET, N.W.
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WASHINGTON, D.C. 20004-2128
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