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Patent Assignment Details
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Reel/Frame:013378/0926   Pages: 3
Recorded: 10/08/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
09/24/2002
Application #:
09664599
Filing Dt:
09/18/2000
Title:
INTEGRATED HEAT SINKING PACKAGES USING LOW TEMPERATURE COFIRED CERAMIC METAL CIRCUIT BOARD TECHNOLOGY
2
Patent #:
Issue Dt:
02/11/2003
Application #:
09852901
Filing Dt:
05/10/2001
Publication #:
Pub Dt:
11/14/2002
Title:
CERAMIC MULTILAYER CIRCUIT BOARDS MOUNTED ON A PATTERNED METAL SUPPORT SUBSTRATE
Assignor
1
Exec Dt:
09/27/2002
Assignee
1
120 HANCOCK LANE
WESTAMPTON, NEW JERSEY 08060
Correspondence name and address
BIRGIT E. MORRIS, ESQ
16 INDIAN HEAD RD.
MORRISTOWN, NJ 07960

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