Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 018220/0926 | |
| Pages: | 4 |
| | Recorded: | 08/25/2006 | | |
Attorney Dkt #: | 108298876US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2013
|
Application #:
|
11510026
|
Filing Dt:
|
08/25/2006
|
Publication #:
|
|
Pub Dt:
|
02/28/2008
| | | | |
Title:
|
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, AND ASSOCIATED METHODS
|
|
Assignee
|
|
|
8000 SOUTH FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83716-9632 |
|
Correspondence name and address
|
|
CHEN LIANG
|
|
PERKINS COIE LLP
|
|
P.O. BOX 1247
|
|
SEATTLE, WA 98111-1247
|
Search Results as of:
05/29/2024 11:50 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|