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Total properties:
48
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Patent #:
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Issue Dt:
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01/26/1999
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Application #:
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08833273
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Filing Dt:
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04/04/1997
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Title:
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ELECTRO-MECHANICAL SUBASSEMBLY HAVING A GREATLY REDUCED THERMAL RESIS TANCE BETWEEN TWO MATING FACES BY INCLUDING A FILM OF LIQUID, THAT EVAPORATES WITHOUT LEAVING ANY RESIDUE, BETWEEN THE FACES
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Patent #:
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Issue Dt:
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12/01/1998
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Application #:
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08833368
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Filing Dt:
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04/04/1997
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Title:
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TEMPERATURE CONTROL SYSTEM FOR AN ELECTRONIC DEVICE IN WHICH DEVICE TEMPERATURE IS ESTIMATED FROM HEATER TEMPERATURE AND HEAT SINK TEMPERATURE
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Patent #:
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Issue Dt:
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10/13/1998
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Application #:
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08833369
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Filing Dt:
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04/04/1997
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Title:
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TEMPERATURE CONTROL SYSTEM FOR AN ELECTRONIC DEVICE WHICH ACHIEVES A QUICK RESPONSE BY INTERPOSING A HEATER BETWEEN THE DEVICE AND A HEAT SINK
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Patent #:
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Issue Dt:
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08/22/2000
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Application #:
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08986772
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Filing Dt:
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12/08/1997
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Title:
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TESTING ASSEMBLY HAVING A PRESSED JOINT WITH A SINGLE LAYER OF THERMAL CONDUCTOR WHICH IS REUSED TO SEQUENTIALLY TEST MULTIPLE CIRCUIT MODULES
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Patent #:
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Issue Dt:
|
06/12/2001
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Application #:
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08986923
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Filing Dt:
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12/08/1997
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Title:
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RESIDUE-FREE METHOD OF ASSEMBLING AND DISASSEMBLING A PRESSED JOINT WITH LOW THERMAL RESISTANCE
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Patent #:
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Issue Dt:
|
07/06/1999
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Application #:
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09173580
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Filing Dt:
|
10/15/1998
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Title:
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METHOD OF THERMALLY COUPLING AN ELECTRONIC DEVICE TO A HEAT EXCHANGE MEMBER WHILE SAID ELECTRONIC DEVICE IS BEING TESTED
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Patent #:
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Issue Dt:
|
03/06/2001
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Application #:
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09210259
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Filing Dt:
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12/10/1998
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Title:
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MECHANICAL ASSEMBLY FOR REGULATING THE TEMPERTURE OF AN ELECTRONIC DEVICE WHICH INCORPORATES A HEAT EXCHANGER THAT CONTACTS AN ENTIRE PLANAR FACE ON THE DEVICE EXCEPT FOR ITS CORNERS
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Patent #:
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Issue Dt:
|
01/30/2001
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Application #:
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09210264
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Filing Dt:
|
12/10/1998
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Title:
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MECHANICAL ASSEMBLY FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC DEVICE WHICH INCORPORATES AT LEAST TWO LEAF SPRINGS FOR SELF-ALIGNMENT PLUS A LOW INITIAL CONTACT FORCE AND A LOW PROFILE
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Patent #:
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Issue Dt:
|
09/12/2000
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Application #:
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09210266
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Filing Dt:
|
12/10/1998
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Title:
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MECHANICAL ASSEMBLY FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC DEVICE WHICH INCORPORATES A SINGLE LEAF SPRING FOR SELF-ALIGNMENT PLUS A LOW INITIAL CONTACT FORCE AND A LOW PROFILE
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Patent #:
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Issue Dt:
|
03/26/2002
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Application #:
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09386945
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Filing Dt:
|
08/31/1999
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Title:
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ELECTRONIC SYSTEM FOR TESTING A SET OF MULTIPLE CHIPS CONCURRENTLY OR SEQUENTIALLY IN SELECTABLE SUBSETS UNDER PROGRAM CONTROL TO LIMIT CHIP POWER DISSIPATION
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Patent #:
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|
Issue Dt:
|
03/26/2002
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Application #:
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09386946
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Filing Dt:
|
08/31/1999
|
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Title:
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ELECTRONIC SYSTEM FOR TESTING CHIPS HAVING A SELECTABLE NUMBER OF PATTERN GENERATORS THAT CONCURRENTLY BROADCAST DIFFERENT BIT STREAMS TO SELECTABLE SETS OF CHIP DRIVER CIRCUITS
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Patent #:
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|
Issue Dt:
|
06/11/2002
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Application #:
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09387197
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Filing Dt:
|
08/31/1999
|
|
Title:
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PROGRAM STORAGE DEVICE CONTAINING INSTRUCTIONS THAT ARE SPACED APART BY UNUSED BITS THAT END ON WORD BOUNDARIES AND WHICH GENERATE CHIP TESTING BIT STREAMS OF ANY LENGTH
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|
|
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Patent #:
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|
Issue Dt:
|
07/02/2002
|
Application #:
|
09432965
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Filing Dt:
|
11/03/1999
|
|
Title:
|
MULTI-STAGE ALGORITHMIC PATTERN GENERATOR FOR TESTING IC CHIPS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2002
|
Application #:
|
09432966
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Filing Dt:
|
11/03/1999
|
|
Title:
|
SYSTEM FOR TESTING IC CHIPS SELECTIVELY WITH STORED OR INTERNALLY GENERATED BIT STREAMS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/12/2002
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Application #:
|
09432967
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Filing Dt:
|
11/03/1999
|
|
Title:
|
OUTPUT STAGE OF A MULTI-STAGE ALGORITHMIC PATTERN GENERATOR FOR TESTING IC CHIPS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09432968
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Filing Dt:
|
11/03/1999
|
|
Title:
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INTERMEDIATE STAGE OF A MULTI-STAGE ALGORITHMIC PATTERN GENERATOR FOR TESTING IC CHIPS
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|
|
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Patent #:
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|
Issue Dt:
|
05/27/2003
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Application #:
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09432969
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Filing Dt:
|
11/03/1999
|
|
Title:
|
INITIAL STAGE OF A MULTI-STAGE ALGORITHMIC PATTERN GENERATOR FOR TESTING IC CHIPS
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|
|
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Patent #:
|
|
Issue Dt:
|
10/23/2001
|
Application #:
|
09511789
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Filing Dt:
|
02/23/2000
|
|
Title:
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Electromechanical apparatus for testing IC chips using first and second sets of substrates which are pressed together
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/18/2003
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Application #:
|
09511790
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Filing Dt:
|
02/23/2000
|
|
Publication #:
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|
Pub Dt:
|
08/15/2002
| | | | |
|
Title:
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PLANAR SUBASSEMBLY FOR TESTING IC CHIPS HAVING FACES WITH PRESSED ELECTRICAL CONTACTS THAT CARRY ALL POWER AND SIGNALS FOR THE CHIPS
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|
|
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Patent #:
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|
Issue Dt:
|
10/23/2001
|
Application #:
|
09511791
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Filing Dt:
|
02/23/2000
|
|
Title:
|
Pivoting springy mechanism that opens and closes pressed electrical contacts with a force which is nearly constant over a range of closed positions
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/04/2001
|
Application #:
|
09511792
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Filing Dt:
|
02/23/2000
|
|
Title:
|
Apparatus for testing IC Chips using a sliding springy mechanism which exerts a nearly constant force
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2002
|
Application #:
|
09574784
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
SYSTEM FOR REGULATING THE TEMPERATURE OF IC-CHIPS WITH A FLUID WHICH IS HEATED AND COOLED AS A FUNCTION OF THE FLUID TEMPERATURES TO AND FROM HEAT EXCHANGERS FOR THE IC-CHIPS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/26/2002
|
Application #:
|
09575346
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Filing Dt:
|
05/19/2000
|
|
Title:
|
System for regulating the temperature of ic-chips with a fluid whose temperature is controlled quickly by a slow response cooler and a fast response heater
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2001
|
Application #:
|
09639308
|
Filing Dt:
|
08/14/2000
|
|
Title:
|
Connector for making multiple pressed co-axial connections having an air dielectric
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2001
|
Application #:
|
09686039
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Filing Dt:
|
10/11/2000
|
|
Title:
|
Connector for sending power to an IC-chip thru four pressed joints in series
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2002
|
Application #:
|
09754507
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Filing Dt:
|
10/11/2000
|
|
Title:
|
Connector for sending power to an ic-chip thru two pressed joints in series
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09779420
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Filing Dt:
|
02/07/2001
|
|
Title:
|
POWER SYSTEM HAVING PRESSED ELECTRICAL CONTACTS AND WHICH DETECTS FAULTS IN THE CONTACTS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2003
|
Application #:
|
09912836
|
Filing Dt:
|
07/24/2001
|
|
Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
|
Title:
|
METHOD OF FABRICATING AN ALLOY FILM ON A FACE OF A HEAT EXCHANGER FOR AN INTEGRATED CIRCUIT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2002
|
Application #:
|
09912842
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Filing Dt:
|
07/24/2001
|
|
Title:
|
MECHANICAL ASSEMBLY FOR FABRICATING AN ALLOY FILM ON A FACE OF A HEAT EXCHANGER FOR AN INTEGRATED CIRCUIT
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/24/2003
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Application #:
|
09976416
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Filing Dt:
|
10/11/2001
|
|
Title:
|
INTEGRATED CIRCUIT TESTER HAVING A FAIL-SAFE MECHANISM FOR MOVING IC-CHIPS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2003
|
Application #:
|
10215992
|
Filing Dt:
|
08/09/2002
|
|
Title:
|
METHOD OF FABRICATING A HEAT EXCHANGER, FOR REGULATING THE TEMPERATURE OF MULTIPLE INTEGRATED CICUIT MODULES, HAVING A FACE OF A SOLID MALLEABLE METAL COATED WITH A RELEASE AGENT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/23/2004
|
Application #:
|
10215993
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Filing Dt:
|
08/09/2002
|
|
Title:
|
METHOD AND APPARATUS FOR REGULATING THE TEMPERATURE OF INTEGRATED CIRCUIT MODULES, USING A HEAT EXCHAGER WITH A FACE OF A SOLID MALLEABLE METAL AND A RELEASE AGENT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/2004
|
Application #:
|
10391884
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Filing Dt:
|
03/18/2003
|
|
Title:
|
ABRUPT POWER CHANGE METHOD OF PREVENTING AN INTEGRATED CIRCUIT CHIP FROM BEING THERMALLY DESTROYED, IN A TESTER, DUE TO A DEFECTIVE PRESSED JOINT
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/10/2004
|
Application #:
|
10391887
|
Filing Dt:
|
03/18/2003
|
|
Title:
|
INITIAL CONTACT METHOD OF PREVENTING AN INTEGRATED CIRCUIT CHIP FROM BEING THERMALLY DESTROYED, IN A TESTER, DUE TO A DEFECTIVE PRESSED JOINT
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|
|
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|
Patent #:
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|
Issue Dt:
|
02/28/2006
|
Application #:
|
10625051
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Filing Dt:
|
07/22/2003
|
|
Title:
|
METHOD OF EXTENDING THE OPERATIONAL PERIOD OF A HEAT-EXCHANGER IN A CHIP TESTER
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|
|
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Patent #:
|
|
Issue Dt:
|
07/05/2005
|
Application #:
|
10625064
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Filing Dt:
|
07/22/2003
|
|
Title:
|
CHIP TESTER HAVING A HEAT-EXCHANGER WITH AN EXTENDABLE PERIOD OF OPERATION
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|
|
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Patent #:
|
|
Issue Dt:
|
12/18/2007
|
Application #:
|
10647090
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Filing Dt:
|
08/21/2003
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|
Publication #:
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|
Pub Dt:
|
02/24/2005
| | | | |
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Title:
|
TEMPERATURE CONTROL SYSTEM WHICH SPRAYS LIQUID COOLANT DROPLETS AGAINST AN IC-MODULE AT A SUB-ATMOSPHERIC PRESSURE
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|
|
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Patent #:
|
|
Issue Dt:
|
02/07/2006
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Application #:
|
10647091
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Filing Dt:
|
08/21/2003
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|
Publication #:
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|
Pub Dt:
|
03/24/2005
| | | | |
|
Title:
|
TEMPERATURE CONTROL SYSTEM WHICH SPRAYS LIQUID COOLANT DROPLETS AGAINST AN IC-MODULE AND DIRECTS RADIATION AGAINST THE IC-MODULE
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|
|
|
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Patent #:
|
|
Issue Dt:
|
06/21/2005
|
Application #:
|
10705368
|
Filing Dt:
|
11/10/2003
|
|
Title:
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SYSTEM FOR TESTING MULTIPLE GROUPS OF IC-CHIPS WHICH CONCURRENTLY SENDS TIME-SHIFTED TEST SIGNALS TO THE GROUPS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2005
|
Application #:
|
10705369
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Filing Dt:
|
11/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
|
Title:
|
SYSTEM FOR TESTING A GROUP OF IC-CHIPS HAVING A CHIP HOLDING SUBASSEMBLY THAT IS BUILT-IN AND LOADED/UNLOADED AUTOMATICALLY
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|
|
|
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Patent #:
|
|
Issue Dt:
|
08/02/2005
|
Application #:
|
10705524
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Filing Dt:
|
11/10/2003
|
|
Publication #:
|
|
Pub Dt:
|
05/12/2005
| | | | |
|
Title:
|
SYSTEM FOR TESTING ONE OR MORE GROUPS OF IC-CHIPS WHILE CONCURRENTLY LOADING/UNLOADING ANOTHER GROUP
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|
|
|
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Patent #:
|
|
Issue Dt:
|
10/25/2005
|
Application #:
|
10759910
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Filing Dt:
|
01/16/2004
|
|
Title:
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ELECTROMECHANICAL MODULE, FOR HOLDING IC-CHIPS IN A CHIP TESTING SYSTEM, THAT SYNCHRONIZES AND TRANSLATES TEST SIGNALS TO THE IC-CHIPS
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|
|
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Patent #:
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|
Issue Dt:
|
11/29/2005
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Application #:
|
10759917
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Filing Dt:
|
01/16/2004
|
|
Title:
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SINGLE-TRANSISTOR TWO RESISTOR CIRCUIT WHICH TRANSLATE TEST SIGNALS TO SELECTABLE VOLTAGE LEVELS
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|
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|
Patent #:
|
|
Issue Dt:
|
04/03/2007
|
Application #:
|
10780417
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Filing Dt:
|
02/16/2004
|
|
Publication #:
|
|
Pub Dt:
|
01/18/2007
| | | | |
|
Title:
|
DUAL FEEDBACK CONTROL SYSTEM FOR MAINTAINING THE TEMPERATURE OF AN IC-CHIP NEAR A SET-POINT
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/27/2005
|
Application #:
|
10850281
|
Filing Dt:
|
05/19/2004
|
|
Title:
|
METHOD OF CONTROLLING THE OPERATION OF A DIGITAL STATE MACHINE FROM A MASTER CONTROLLER IN AN IC-CHIP TESTING SYSTEM
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|
|
|
|
Patent #:
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|
Issue Dt:
|
05/20/2008
|
Application #:
|
10879245
|
Filing Dt:
|
06/28/2004
|
|
Title:
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MECHANICAL ASSEMBLY, FOR REGULATING THE TEMPERATURE OF AN IC-CHIP, HAVING A GIMBALED HEAT-EXCHANGER WITH COILED SPRINGY CONDUITS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/17/2007
|
Application #:
|
10992308
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Filing Dt:
|
11/18/2004
|
|
Publication #:
|
|
Pub Dt:
|
05/18/2006
| | | | |
|
Title:
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MECHANICAL ASSEMBLY FOR REGULATING THE TEMPERATURE OF AN ELECTRONIC DEVICE, HAVING A SPRING WITH ONE SLIDEABLE END
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|
|
|
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Patent #:
|
|
Issue Dt:
|
04/08/2008
|
Application #:
|
11282209
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Filing Dt:
|
11/18/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/24/2007
| | | | |
|
Title:
|
METHOD OF AUTOMATICALLY CARRYING IC-CHIPS, ON A PLANAR ARRAY OF VACUUM NOZZLES, TO A VARIABLE TARGET IN A CHIP TESTER
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