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Patent Assignment Details
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Reel/Frame:008467/0928   Pages: 2
Recorded: 03/19/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/26/2001
Application #:
08822564
Filing Dt:
03/19/1997
Title:
METHOD OF RENDERING A SUBSTRATE SELECTIVELY NON-WETTABLE CHIP CARRIER WITH ENHANCED WIRE BONDABILITY
Assignors
1
Exec Dt:
03/18/1997
2
Exec Dt:
03/17/1997
3
Exec Dt:
03/18/1997
Assignee
1
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
HESLIN & ROTHENBERG, P.C.
CANDICE J. CLEMENT, ESQ.
5 COLUMBIA CIRCLE
ALBANY, NY 12203

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