Patent Assignment Details
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| Reel/Frame: | 004299/0929 | |
| Pages: | 2 |
| | Recorded: | 09/13/1984 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/1985
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Application #:
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06626359
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Filing Dt:
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06/29/1984
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Title:
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HIGH DENSITY WIRED MODULE
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Correspondence name and address
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ROBERT J. HAASE
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IBM CORP., PATENT OPERS.
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DEPT. 901, BLDG. 300-482
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HOPEWELL JUNCTION, NY 12533
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