Patent Assignment Details
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Reel/Frame: | 011554/0931 | |
| Pages: | 4 |
| | Recorded: | 02/20/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/25/2003
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Application #:
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09788112
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Filing Dt:
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02/16/2001
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Publication #:
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Pub Dt:
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09/06/2001
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Title:
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PRESSURE SENSITIVE ADHESIVE SHEET FOR WAFER STICKING
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Assignees
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7-1, SHIBA 5-CHOME, MINATO-KU |
TOKYO, JAPAN |
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN |
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Correspondence name and address
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WEBB ZIESENHEIM LOGSDON ORKIN ET AL
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KENT E. BALDAUF, SR.
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700 KOPPERS BUILDING
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436 SEVENTH AVENUE
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PITTSBURGH, PENNSYLVANIA 15219-1818
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