Patent Assignment Details
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Reel/Frame: | 011656/0934 | |
| Pages: | 2 |
| | Recorded: | 03/26/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2003
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Application #:
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09776465
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Filing Dt:
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02/02/2001
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Publication #:
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Pub Dt:
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08/08/2002
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Title:
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FLIP CHIP SEMICONDUCTOR DEVICE IN A MOLDED CHIP SCALE PACKAGE (CSP) AND METHOD OF ASSEMBLY
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Assignee
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MS 3999 |
P.O. BOX 655474 |
DALLAS, TEXAS 75265 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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GARY C. HONEYCUTT
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P.O. BOX 655474, MS 3999
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DALLAS, TX 75265
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