Patent Assignment Details
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Reel/Frame: | 013928/0935 | |
| Pages: | 2 |
| | Recorded: | 04/08/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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10310722
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Filing Dt:
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12/05/2002
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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METHOD OF FORMING A COPPER WIRING IN A SEMICONDUCTOR DEVICE
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Assignee
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SAN 136-1, AMI-RI |
BUBAL-EUP, ICHON-SHI |
KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MICHAEL R. HULL
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6300 SEARS TOWER
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233 S. WACKER DRIVE
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CHICAGO, IL 60606-6357
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