Patent Assignment Details
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| Reel/Frame: | 013267/0936 | |
| Pages: | 3 |
| | Recorded: | 09/04/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/03/2004
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Application #:
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10235762
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Filing Dt:
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09/04/2002
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Title:
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SOLDER PAD STRUCTURE FOR LOW TEMPERATURE CO-FIRED CERAMIC PACKAGE AND METHOD FOR MAKING THE SAME
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Assignee
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| 2500 CONDENSA STREET |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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MARTINE & PENILLA, LLP
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ALBERT S. PENNILLA, ESQ.
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710 LAKEWAY DRIVE
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SUITE 170
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SUNNYVALE, CA 94085
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