|
Total properties:
46
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Patent #:
|
|
Issue Dt:
|
05/23/2006
|
Application #:
|
10622346
|
Filing Dt:
|
07/19/2003
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|
Title:
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SEMICONDUCTOR PACKAGE INCLUDING ORGANO-METALLIC COATING FORMED ON SURFACE OF LEADFRAME ROUGHENED USING CHEMICAL ETCHANT TO PREVENT SEPARATION BETWEEN LEADFRAME AND MOLDING COMPOUND
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|
Patent #:
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|
Issue Dt:
|
12/26/2006
|
Application #:
|
10637965
|
Filing Dt:
|
08/08/2003
|
|
Title:
|
METHOD OF FABRICATING NO-LEAD PACKAGE FOR SEMICONDUCTOR DIE WITH HALF-ETCHED LEADFRAME
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|
|
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Patent #:
|
|
Issue Dt:
|
06/13/2006
|
Application #:
|
10696380
|
Filing Dt:
|
10/29/2003
|
|
Title:
|
FLAT NO-LEAD SEMICONDUCTOR DIE PACKAGE INCLUDING STUD TERMINALS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2005
|
Application #:
|
10823280
|
Filing Dt:
|
04/12/2004
|
|
Title:
|
METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE USING SCREEN PRINTING OF EPOXY ON WATER
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2009
|
Application #:
|
11717912
|
Filing Dt:
|
03/13/2007
|
|
Title:
|
METHOD AND APPARATUS FOR HIGH SPEED SINGULATION
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/13/2012
|
Application #:
|
11731522
|
Filing Dt:
|
03/30/2007
|
|
Title:
|
LEAD FRAME LAND GRID ARRAY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
11788496
|
Filing Dt:
|
04/19/2007
|
|
Publication #:
|
|
Pub Dt:
|
05/27/2010
| | | | |
|
Title:
|
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/06/2011
|
Application #:
|
11899189
|
Filing Dt:
|
09/04/2007
|
|
Title:
|
PACKAGE WITH HEAT TRANSFER
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
12002186
|
Filing Dt:
|
12/14/2007
|
|
Title:
|
Molded leadframe substrate semiconductor package
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
12070191
|
Filing Dt:
|
02/14/2008
|
|
Title:
|
Method of and system for cooling a singulation process
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/18/2010
|
Application #:
|
12128828
|
Filing Dt:
|
05/29/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/04/2008
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR PLATING A SEMICONDUCTOR PACKAGE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2011
|
Application #:
|
12154483
|
Filing Dt:
|
05/22/2008
|
|
Title:
|
METHOD AND APPARATUS FOR NO LEAD SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2013
|
Application #:
|
12220236
|
Filing Dt:
|
07/22/2008
|
|
Title:
|
High pressure cooling nozzle for semiconductor package
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2010
|
Application #:
|
12287174
|
Filing Dt:
|
10/06/2008
|
|
Title:
|
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/04/2015
|
Application #:
|
12383135
|
Filing Dt:
|
03/19/2009
|
|
Publication #:
|
|
Pub Dt:
|
08/20/2009
| | | | |
|
Title:
|
METHOD FOR FORMING LEAD FRAME LAND GRID ARRAY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2012
|
Application #:
|
12567320
|
Filing Dt:
|
09/25/2009
|
|
Title:
|
METHOD AND APPARATUS TO PREVENT DOUBLE SEMICONDUCTOR UNITS IN TEST SOCKET
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/04/2015
|
Application #:
|
12576846
|
Filing Dt:
|
10/09/2009
|
|
Title:
|
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
12579574
|
Filing Dt:
|
10/15/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
|
Title:
|
METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICONDUCTOR PACKAGE TO PREVENT OXIDE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2013
|
Application #:
|
12579600
|
Filing Dt:
|
10/15/2009
|
|
Publication #:
|
|
Pub Dt:
|
09/16/2010
| | | | |
|
Title:
|
METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICONDUCTOR PACKAGE TO PREVENT OXIDE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
12661444
|
Filing Dt:
|
03/16/2010
|
|
Title:
|
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2016
|
Application #:
|
12834688
|
Filing Dt:
|
07/12/2010
|
|
Publication #:
|
|
Pub Dt:
|
01/27/2011
| | | | |
|
Title:
|
LEADFRAME FEATURE TO MINIMIZE FLIP-CHIP SEMICONDUCTOR DIE COLLAPSE DURING FLIP-CHIP REFLOW
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/06/2011
|
Application #:
|
12838252
|
Filing Dt:
|
07/16/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/09/2010
| | | | |
|
Title:
|
METHOD AND APPARATUS FOR NO LEAD SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2012
|
Application #:
|
12868560
|
Filing Dt:
|
08/25/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2010
| | | | |
|
Title:
|
PACKAGE WITH HEAT TRANSFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/17/2018
|
Application #:
|
12914694
|
Filing Dt:
|
10/28/2010
|
|
Publication #:
|
|
Pub Dt:
|
02/17/2011
| | | | |
|
Title:
|
FLIP CHIP CAVITY PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
12960268
|
Filing Dt:
|
12/03/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/09/2011
| | | | |
|
Title:
|
AUXILIARY LEADFRAME MEMBER FOR STABILIZING THE BOND WIRE PROCESS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/20/2018
|
Application #:
|
12964698
|
Filing Dt:
|
12/09/2010
|
|
Publication #:
|
|
Pub Dt:
|
03/31/2011
| | | | |
|
Title:
|
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2014
|
Application #:
|
13019152
|
Filing Dt:
|
02/01/2011
|
|
Publication #:
|
|
Pub Dt:
|
10/06/2011
| | | | |
|
Title:
|
APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2013
|
Application #:
|
13040112
|
Filing Dt:
|
03/03/2011
|
|
Publication #:
|
|
Pub Dt:
|
06/23/2011
| | | | |
|
Title:
|
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
13045253
|
Filing Dt:
|
03/10/2011
|
|
Publication #:
|
|
Pub Dt:
|
09/15/2011
| | | | |
|
Title:
|
LEADFRAME BASED MULTI TERMINAL IC PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2013
|
Application #:
|
13080512
|
Filing Dt:
|
04/05/2011
|
|
Publication #:
|
|
Pub Dt:
|
08/18/2011
| | | | |
|
Title:
|
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/30/2013
|
Application #:
|
13156257
|
Filing Dt:
|
06/08/2011
|
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
|
Title:
|
METALLIC SOLDERABILITY PRESERVATION COATING ON METAL PART OF SEMICONDUCTOR PACKAGE TO PREVENT OXIDE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/24/2016
|
Application #:
|
13214106
|
Filing Dt:
|
08/19/2011
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2012
| | | | |
|
Title:
|
SINGULATION METHOD FOR SEMICONDUCTOR PACKAGE WITH PLATING ON SIDE OF CONNECTORS
|
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13235124
|
Filing Dt:
|
09/16/2011
|
|
Publication #:
|
|
Pub Dt:
|
01/12/2012
| | | | |
|
Title:
|
METHOD OF AND SYSTEM FOR COOLING A SINGULATION PROCESS
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|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
13333897
|
Filing Dt:
|
12/21/2011
|
|
Publication #:
|
|
Pub Dt:
|
04/19/2012
| | | | |
|
Title:
|
APPARATUS FOR AND METHODS OF ATTACHING HEAT SLUGS TO PACKAGE TOPS
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|
|
|
|
Patent #:
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|
Issue Dt:
|
02/11/2014
|
Application #:
|
13603311
|
Filing Dt:
|
09/04/2012
|
|
Publication #:
|
|
Pub Dt:
|
09/12/2013
| | | | |
|
Title:
|
LEAD FRAME LAND GRID ARRAY
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/2015
|
Application #:
|
13689566
|
Filing Dt:
|
11/29/2012
|
|
Title:
|
POST-MOLD FOR SEMICONDUCTOR PACKAGE HAVING EXPOSED TRACES
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|
|
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|
Patent #:
|
|
Issue Dt:
|
06/11/2013
|
Application #:
|
13715660
|
Filing Dt:
|
12/14/2012
|
|
Title:
|
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE HAVING INTERLOCKING FEATURES
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|
Patent #:
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|
Issue Dt:
|
06/11/2013
|
Application #:
|
13715771
|
Filing Dt:
|
12/14/2012
|
|
Title:
|
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE HAVING INTERLOCKING FEATURES
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|
|
|
|
Patent #:
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|
Issue Dt:
|
05/13/2014
|
Application #:
|
13769021
|
Filing Dt:
|
02/15/2013
|
|
Publication #:
|
|
Pub Dt:
|
08/15/2013
| | | | |
|
Title:
|
LEADFRAME BASED MULTI TERMINAL IC PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/12/2015
|
Application #:
|
13850994
|
Filing Dt:
|
03/26/2013
|
|
Publication #:
|
|
Pub Dt:
|
11/14/2013
| | | | |
|
Title:
|
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES INCLUDING TERMINALS WITH INTERNAL ROUTING INTERCONNECTIONS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/20/2016
|
Application #:
|
13851007
|
Filing Dt:
|
03/26/2013
|
|
Publication #:
|
|
Pub Dt:
|
11/14/2013
| | | | |
|
Title:
|
PLATED TERMINALS WITH ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13851822
|
Filing Dt:
|
03/27/2013
|
|
Publication #:
|
|
Pub Dt:
|
11/14/2013
| | | | |
|
Title:
|
PROTRUDING TERMINALS WITH INTERNAL ROUTING INTERCONNECTIONS SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/28/2015
|
Application #:
|
13886888
|
Filing Dt:
|
05/03/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2013
| | | | |
|
Title:
|
MOLDED LEADFRAME SUBSTRATE SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2014
|
Application #:
|
13904931
|
Filing Dt:
|
05/29/2013
|
|
Publication #:
|
|
Pub Dt:
|
10/24/2013
| | | | |
|
Title:
|
LEAD FRAME BALL GRID ARRAY WITH TRACES UNDER DIE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2014
|
Application #:
|
13904975
|
Filing Dt:
|
05/29/2013
|
|
Publication #:
|
|
Pub Dt:
|
12/19/2013
| | | | |
|
Title:
|
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
13970392
|
Filing Dt:
|
08/19/2013
|
|
Publication #:
|
|
Pub Dt:
|
01/16/2014
| | | | |
|
Title:
|
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
|
|
