Patent Assignment Details
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| Reel/Frame: | 007610/0940 | |
| Pages: | 3 |
| | Recorded: | 05/08/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/14/1997
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Application #:
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08436522
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Filing Dt:
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05/08/1995
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Title:
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SEMICONDUCTOR CHIP PACKAGE
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Assignee
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| MAIL STOP 507 |
| 2805 E. COLUMBIA ROAD |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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FIRST INTERSTATE CENTER
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STEVEN R. ORMISTON
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877 W. MAIN ST., STE. 507
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P.O. BOX 2894
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BOISE, ID 83701
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