Patent Assignment Details
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Reel/Frame: | 052664/0942 | |
| Pages: | 17 |
| | Recorded: | 05/14/2020 | | |
Attorney Dkt #: | 5440/0525PUS1 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 52100 FRAME: 696. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16816108
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Filing Dt:
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03/11/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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DIE BONDING PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
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Assignee
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NO. 841-899, MIN AN ROAD |
HONGTANG TOWN, TONGAN DISTRICT XIAMEN |
FUJIAN, CHINA |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PC
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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05/26/2024 03:07 AM
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