Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 036227/0943 | |
| Pages: | 7 |
| | Recorded: | 07/31/2015 | | |
Attorney Dkt #: | 2515.0478 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2019
|
Application #:
|
14814906
|
Filing Dt:
|
07/31/2015
|
Publication #:
|
|
Pub Dt:
|
02/11/2016
| | | | |
Title:
|
Semiconductor Device and Method of Forming Double-Sided Fan-Out Wafer Level Package
|
|
Assignee
|
|
|
10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
|
Correspondence name and address
|
|
STATS CHIPPAC/PATENT LAW GROUP: ATKINS A
|
|
55 N. ARIZONA PLACE, SUITE 104
|
|
CHANDLER, AZ 85225
|
Search Results as of:
06/01/2024 01:32 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|