Patent Assignment Details
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| Reel/Frame: | 040254/0943 | |
| Pages: | 9 |
| | Recorded: | 11/08/2016 | | |
| Attorney Dkt #: | 70027-2275 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/23/2018
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Application #:
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15226735
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Filing Dt:
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08/02/2016
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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WONG & REES LLP
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4340 STEVENS CREEK BLVD.
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SUITE 106
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SAN JOSE, CA 95129
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