Patent Assignment Details
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| Reel/Frame: | 025086/0945 | |
| Pages: | 5 |
| | Recorded: | 10/04/2010 | | |
| Attorney Dkt #: | 2007P17259US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12897249
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Filing Dt:
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10/04/2010
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Publication #:
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Pub Dt:
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01/27/2011
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Title:
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METHOD FOR SOLDERING WITH A MULTISTEP TEMPERATURE PROFILE
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Assignee
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| WITTELSBACHERPLATZ 2 |
| MUENCHEN, GERMANY 80333 |
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Correspondence name and address
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ELSA KELLER
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SIEMENS CORPORATION - IP DEPT
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170 WOOD AVENUE SOUTH
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ISELIN, NJ 08830
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