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Patent Assignment Details

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Reel/Frame:	029395/0945			Pages:	5
		Recorded:	12/02/2012
Attorney Dkt #:	6757-38500
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 20

Patent #:	5612570	Issue Dt:	03/18/1997	Application #:	08421801	Filing Dt:	04/13/1995
Title:	CHIP STACK AND METHOD OF MAKING SAME

Patent #:	5869353	Issue Dt:	02/09/1999	Application #:	08971499	Filing Dt:	11/17/1997
Title:	MODULAR PANEL STACKING PROCESS

Patent #:	6222737	Issue Dt:	04/24/2001	Application #:	09298664	Filing Dt:	04/23/1999
Title:	UNIVERSAL PACKAGE AND METHOD OF FORMING THE SAME

Patent #:	6323060	Issue Dt:	11/27/2001	Application #:	09305584	Filing Dt:	05/05/1999
Title:	STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME

Patent #:	6262895	Issue Dt:	07/17/2001	Application #:	09482294	Filing Dt:	01/13/2000
Title:	STACKABLE CHIP PACKAGE WITH FLEX CARRIER

Patent #:	6437433	Issue Dt:	08/20/2002	Application #:	09535641	Filing Dt:	03/24/2000
Title:	CSP STACKING TECHNOLOGY USING RIGID/FLEX CONSTRUCTION

Patent #:	6351029	Issue Dt:	02/26/2002	Application #:	09574321	Filing Dt:	05/19/2000
Title:	Stackable flex circuit chip package and method of making same

Patent #:	6236565	Issue Dt:	05/22/2001	Application #:	09594363	Filing Dt:	06/15/2000
Title:	Chip stack with active cooling system

Patent #:	6404043	Issue Dt:	06/11/2002	Application #:	09598343	Filing Dt:	06/21/2000
Title:	PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES

Patent #:	6360433	Issue Dt:	03/26/2002	Application #:	09664938	Filing Dt:	09/19/2000
Title:	method of forming universal package

Patent #:	6472735	Issue Dt:	10/29/2002	Application #:	09826621	Filing Dt:	04/05/2001
Publication #:	US20010054758	Pub Dt:	12/27/2001
Title:	THREE-DIMENSIONAL MEMORY STACKING USING ANISOTROPIC EPOXY INTERCONNECTIONS

Patent #:	6473308	Issue Dt:	10/29/2002	Application #:	09838773	Filing Dt:	04/19/2001
Publication #:	US20010015487	Pub Dt:	08/23/2001
Title:	STACKABLE CHIP PACKAGE WITH FLEX CARRIER

Patent #:	6426240	Issue Dt:	07/30/2002	Application #:	09888785	Filing Dt:	06/25/2001
Publication #:	US20010035572	Pub Dt:	11/01/2001
Title:	STACKABLE FLEX CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME

Patent #:	6514793	Issue Dt:	02/04/2003	Application #:	09888792	Filing Dt:	06/25/2001
Publication #:	US20020048849	Pub Dt:	04/25/2002
Title:	STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME

Patent #:	6627984	Issue Dt:	09/30/2003	Application #:	09912010	Filing Dt:	07/24/2001
Publication #:	US20030020153	Pub Dt:	01/30/2003
Title:	CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES

Patent #:	6544815	Issue Dt:	04/08/2003	Application #:	09922977	Filing Dt:	08/06/2001
Publication #:	US20010054770	Pub Dt:	12/27/2001
Title:	PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES

Patent #:	6573460	Issue Dt:	06/03/2003	Application #:	09957190	Filing Dt:	09/20/2001
Publication #:	US20030051906	Pub Dt:	03/20/2003
Title:	POST IN RING INTERCONNECT USING FOR 3-D STACKING

Patent #:	6908792	Issue Dt:	06/21/2005	Application #:	10263859	Filing Dt:	10/03/2002
Publication #:	US20030025211	Pub Dt:	02/06/2003
Title:	CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES

Patent #:	RE39628	Issue Dt:	05/15/2007	Application #:	10900073	Filing Dt:	07/27/2004
Title:	STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME

Patent #:	RE41039	Issue Dt:	12/15/2009	Application #:	10974046	Filing Dt:	10/26/2004
Title:	STACKABLE CHIP PACKAGE WITH FLEX CARRIER

Assignor

Exec Dt:

08/10/2001

Assignee

7321 LINCOLN WAY

GARDEN GROVE, CALIFORNIA 92841

Correspondence name and address
	DAWN DELUCA
	1120 SOUTH CAPITAL OF TEXAS HIGHWAY
	BUILDING 2, SUITE 300
	AUSTIN, TX 78746

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