Patent Assignment Details
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| Reel/Frame: | 052364/0956 | |
| Pages: | 4 |
| | Recorded: | 04/10/2020 | | |
| Attorney Dkt #: | 00258.0063.00US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13896593
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Filing Dt:
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05/17/2013
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Publication #:
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Pub Dt:
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11/21/2013
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Title:
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METHOD FOR LOW TEMPERATURE WAFER BONDING AND BONDED STRUCTURE
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Assignees
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| NO.204, CIRCULAR ARC BUILDING, NO.60, WEST ROAD, NEW INDUSTRIAL PARK, HIGH-TECH ZONE |
| XI'AN, CHINA 710119 |
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| BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT |
| NINGBO, CHINA 315800 |
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Correspondence name and address
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ANOVA LAW GROUP C/O SMIC
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21495 RIDGETOP CIRCLE
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SUITE 300
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STERLING, VA 20166
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