Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 040434/0957 | |
| Pages: | 4 |
| | Recorded: | 11/28/2016 | | |
| Attorney Dkt #: | 102351-0856 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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15362548
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Filing Dt:
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11/28/2016
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Publication #:
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Pub Dt:
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05/31/2018
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Title:
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SEMICONDUCTOR DEVICE PACKAGE INCLUDING FILLING MOLD VIA
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Assignee
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K STREET, N.W.
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SUITE 600
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WASHINGTON, DC 20007
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05/23/2024 01:02 PM
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