Patent Assignment Details
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Reel/Frame: | 042519/0958 | |
| Pages: | 7 |
| | Recorded: | 05/26/2017 | | |
Attorney Dkt #: | VEST/0257USPC01 (089022) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/22/2019
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Application #:
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15607184
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Filing Dt:
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05/26/2017
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Publication #:
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Pub Dt:
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09/14/2017
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Title:
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HEAT SINK FOR COOLING OF POWER SEMICONDUCTOR MODULES
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Assignee
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HEDEAGER 44 |
AARHUS N, DENMARK DK-8200 |
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Correspondence name and address
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PATTERSON & SHERIDAN, LLP / VESTAS
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24 GREENWAY PLAZA, SUITE 1600
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HOUSTON, TX 77046
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05/28/2024 09:23 AM
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