Patent Assignment Details
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| Reel/Frame: | 024736/0959 | |
| Pages: | 3 |
| | Recorded: | 07/23/2010 | | |
| Conveyance: | STATEMENT UNDER 3.73(B) & POWER OF ATTORNEY |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12834125
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Filing Dt:
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07/12/2010
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Publication #:
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Pub Dt:
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07/07/2011
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Title:
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METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MICROELECTRONIC DEVICES FORMED BY SUCH METHODS
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Assignee
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| 26 DEER CREEK LANE |
| MOUNT KISCO, NEW YORK 10549 |
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Correspondence name and address
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RICHARD J. BOTOS
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LERNER, DAVID, LITTENBERG, ET AL
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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