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Patent Assignment Details
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Reel/Frame:010615/0961   Pages: 2
Recorded: 02/14/2000
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
09504007
Filing Dt:
02/14/2000
Publication #:
Pub Dt:
08/01/2002
Title:
Method of forming an integrated circuit device package using a temporary substrate
Assignor
1
Exec Dt:
02/10/2000
Assignee
1
1900 SOUTH PRICE ROAD
CHANDLER, ARIZONA 95248
Correspondence name and address
SKJERVEN, MORRILL, MACPHERSON ET AL
JAMES F. PARSONS
25 METRO DRIVE
SUITE 700
SAN JOSE, CA 95110

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