Patent Assignment Details
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| Reel/Frame: | 039307/0961 | |
| Pages: | 4 |
| | Recorded: | 08/01/2016 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/29/2011
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Application #:
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12032706
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Filing Dt:
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02/18/2008
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Publication #:
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Pub Dt:
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06/19/2008
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Title:
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CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME
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Assignee
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| PARK 2ND RD. |
| ROOM 301/302, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121
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