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Patent Assignment Details
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Reel/Frame:022915/0962   Pages: 18
Recorded: 07/06/2009
Attorney Dkt #:IQLP-MISC
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED ON REEL 022892 FRAME 0082. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 26
1
Patent #:
6339191
Issue Dt:
01/15/2002
Application #:
08208586
Filing Dt:
03/11/1994
Title:
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
2
Patent #:
5819403
Issue Dt:
10/13/1998
Application #:
08465146
Filing Dt:
06/05/1995
Title:
METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP CARRIER
3
Patent #:
5824950
Issue Dt:
10/20/1998
Application #:
08482000
Filing Dt:
06/07/1995
Title:
LOW PROFILE SEMICONDUCTOR DIE CARRIER
4
Patent #:
5821457
Issue Dt:
10/13/1998
Application #:
08902032
Filing Dt:
07/29/1997
Title:
SEMICONDUCTOR DIE CARRIER HAVING A DIELECTRIC EPOXY BETWEEN ADJACENT LEADS
5
Patent #:
6141869
Issue Dt:
11/07/2000
Application #:
09178650
Filing Dt:
10/26/1998
Title:
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
6
Patent #:
6307258
Issue Dt:
10/23/2001
Application #:
09218180
Filing Dt:
12/22/1998
Title:
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
7
Patent #:
6305987
Issue Dt:
10/23/2001
Application #:
09249300
Filing Dt:
02/12/1999
Title:
INTEGRATED CONNECTOR AND SEMICONDUCTOR DIE PACKAGE
8
Patent #:
6857173
Issue Dt:
02/22/2005
Application #:
09705710
Filing Dt:
11/06/2000
Title:
APPARATUS FOR AND METHOD OF MANUFACTURING A SEMICONDUCTOR DIE CARRIER
9
Patent #:
7135768
Issue Dt:
11/14/2006
Application #:
09946554
Filing Dt:
09/06/2001
Publication #:
US20030042598
Pub Dt:
03/06/2003
Title:
HERMETIC SEAL
10
Patent #:
6475832
Issue Dt:
11/05/2002
Application #:
09950702
Filing Dt:
09/13/2001
Publication #:
US20020008308
Pub Dt:
01/24/2002
Title:
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
11
Patent #:
6828511
Issue Dt:
12/07/2004
Application #:
09964542
Filing Dt:
09/28/2001
Publication #:
US20020053455
Pub Dt:
05/09/2002
Title:
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
12
Patent #:
6797882
Issue Dt:
09/28/2004
Application #:
09978772
Filing Dt:
10/18/2001
Title:
DIE PACKAGE FOR CONNECTION TO A SUBSTRATE
13
Patent #:
6709891
Issue Dt:
03/23/2004
Application #:
10231347
Filing Dt:
08/30/2002
Publication #:
US20030003626
Pub Dt:
01/02/2003
Title:
OPEN-CAVITY SEMICONDUCTOR DIE PACKAGE
14
Patent #:
6977432
Issue Dt:
12/20/2005
Application #:
10755414
Filing Dt:
01/13/2004
Publication #:
US20040140542
Pub Dt:
07/22/2004
Title:
PREFABRICATED SEMICONDUCTOR CHIP CARRIER
15
Patent #:
6867367
Issue Dt:
03/15/2005
Application #:
10767309
Filing Dt:
01/29/2004
Publication #:
US20040184239
Pub Dt:
09/23/2004
Title:
PACKAGE FOR INTEGRATED CIRCUIT DIE
16
Patent #:
7253365
Issue Dt:
08/07/2007
Application #:
10878000
Filing Dt:
06/29/2004
Publication #:
US20040232447
Pub Dt:
11/25/2004
Title:
DIE PACKAGE FOR CONNECTION TO A SUBSTRATE
17
Patent #:
NONE
Issue Dt:
Application #:
10920643
Filing Dt:
08/18/2004
Publication #:
US20050016750
Pub Dt:
01/27/2005
Title:
Methods for enclosing a thermoplastic package
18
Patent #:
7053299
Issue Dt:
05/30/2006
Application #:
10920660
Filing Dt:
08/18/2004
Publication #:
US20050012118
Pub Dt:
01/20/2005
Title:
FLANGE FOR INTEGRATED CIRCUIT PACKAGE
19
Patent #:
7736573
Issue Dt:
06/15/2010
Application #:
10920857
Filing Dt:
08/18/2004
Publication #:
US20050012080
Pub Dt:
01/20/2005
Title:
THERMOPLASTIC MATERIAL
20
Patent #:
7803307
Issue Dt:
09/28/2010
Application #:
11146856
Filing Dt:
06/07/2005
Publication #:
US20090295036
Pub Dt:
12/03/2009
Title:
ULTRA HIGH-TEMPERATURE PLASTIC PACKAGE AND METHOD OF MANUFACTURE
21
Patent #:
NONE
Issue Dt:
Application #:
11366941
Filing Dt:
03/02/2006
Publication #:
US20070071268
Pub Dt:
03/29/2007
Title:
Packaged microphone with electrically coupled lid
22
Patent #:
NONE
Issue Dt:
Application #:
11875130
Filing Dt:
10/19/2007
Publication #:
US20080150104
Pub Dt:
06/26/2008
Title:
LEADFRAME WITH DIFFERENT TOPOLOGIES FOR MEMS PACKAGE
23
Patent #:
NONE
Issue Dt:
Application #:
11983791
Filing Dt:
11/09/2007
Publication #:
US20080111148
Pub Dt:
05/15/2008
Title:
Led reflective package
24
Patent #:
7679185
Issue Dt:
03/16/2010
Application #:
11983813
Filing Dt:
11/09/2007
Publication #:
US20080128908
Pub Dt:
06/05/2008
Title:
MICROCIRCUIT PACKAGE HAVING DUCTILE LAYER
25
Patent #:
NONE
Issue Dt:
Application #:
12001792
Filing Dt:
12/12/2007
Publication #:
US20080150064
Pub Dt:
06/26/2008
Title:
Plastic electronic component package
26
Patent #:
NONE
Issue Dt:
Application #:
12220543
Filing Dt:
07/25/2008
Publication #:
US20080305355
Pub Dt:
12/11/2008
Title:
Plastic electronic component package
Assignor
1
QUANTUM LEAP PACKAGING, INC.
Exec Dt:
06/24/2009
Assignee
1
INTERPLEX ENGINEERED PRODUCTS, INC.
231 FERRIS AVENUE
EAST PROVIDENCE, RHODE ISLAND 02916
Correspondence name and address
WEINGARTEN SCHURGIN GAGNEBIN & LEBOVICI
TEN POST OFFICE SQUARE
BOSTON, MA 02109

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