Patent Assignment Details
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| Reel/Frame: | 054539/0966 | |
| Pages: | 14 |
| | Recorded: | 12/03/2020 | | |
| Attorney Dkt #: | MTKP3528USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17111456
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Filing Dt:
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12/03/2020
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Publication #:
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Pub Dt:
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07/15/2021
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Title:
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SEMICONDUCTOR PACKAGE HAVING RE-DISTRIBUTION LAYER STRUCTURE ON SUBSTRATE COMPONENT
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Assignee
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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5F., NO.389, FUHE RD., YONGHE DIST.,
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NEW TAIPEI CITY, TAIWAN
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