Patent Assignment Details
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| Reel/Frame: | 020017/0967 | |
| Pages: | 3 |
| | Recorded: | 10/26/2007 | | |
| Attorney Dkt #: | MEG00-005D-E14 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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11856076
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Filing Dt:
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09/17/2007
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Publication #:
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Pub Dt:
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02/21/2008
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF IC CHIP
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Assignee
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| ROOM 301/302, NO. 47, PARK 2ND RD., |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MEGICA CORPORATION
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ROOM 301/302, NO. 47, PARK 2ND RD.,
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HSINCHU, 300 TAIWAN
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