Patent Assignment Details
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| Reel/Frame: | 027438/0967 | |
| Pages: | 3 |
| | Recorded: | 12/23/2011 | | |
| Attorney Dkt #: | P32892 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/11/2012
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Application #:
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12821847
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Filing Dt:
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06/23/2010
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Publication #:
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Pub Dt:
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12/29/2011
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Title:
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MOLD COMPOUNDS IN IMPROVED EMBEDDED-DIE CORELESS SUBSTRATES, AND PROCESSES OF FORMING SAME
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Assignee
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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INTEL CORPORATION
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C/O CPA GLOBAL
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PO BOX 52050
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MINNEAPOLIS, MN 55402
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