Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 016537/0969 | |
| Pages: | 8 |
| | Recorded: | 05/09/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11041157
|
Filing Dt:
|
01/21/2005
|
|
Publication #:
|
|
Pub Dt:
|
08/25/2005
| | | | |
|
Title:
|
Method for packaging semiconductor chips and corresponding semiconductor chip system
|
|
|
Assignee
|
|
|
|
|
| POSTFACH 30 02 20 |
| D-70442 STUTTGART, GERMANY |
|
|
Correspondence name and address
|
| |
RICHARD L. MAYER
|
| |
KENYON & KENYON
|
| |
ONE BROADWAY
|
| |
NEW YORK, NY 10004
|
Search Results as of:
05/25/2024 01:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
