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Reel/Frame:040275/0970   Pages: 20
Recorded: 11/10/2016
Attorney Dkt #:APT_MICRONAPTINA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 36
1
Patent #:
6271580
Issue Dt:
08/07/2001
Application #:
09301710
Filing Dt:
04/29/1999
Title:
LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
2
Patent #:
6277673
Issue Dt:
08/21/2001
Application #:
09302083
Filing Dt:
04/29/1999
Title:
LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
3
Patent #:
6130474
Issue Dt:
10/10/2000
Application #:
09417159
Filing Dt:
10/12/1999
Title:
LEADS UNDER CHIP IC PACKAGE
4
Patent #:
6320246
Issue Dt:
11/20/2001
Application #:
09556244
Filing Dt:
04/24/2000
Title:
SEMICONDUCTOR WAFER ASSEMBLIES
5
Patent #:
6602785
Issue Dt:
08/05/2003
Application #:
09614361
Filing Dt:
07/12/2000
Title:
METHOD OF FORMING A CONDUCTIVE CONTACT ON A SUBSTRATE AND METHOD OF PROCESSING A SEMICONDUCTOR SUBSTRATE USING AN OZONE TREATMENT
6
Patent #:
6344364
Issue Dt:
02/05/2002
Application #:
09645057
Filing Dt:
08/23/2000
Title:
Etching methods
7
Patent #:
7041550
Issue Dt:
05/09/2006
Application #:
09652579
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
8
Patent #:
6852622
Issue Dt:
02/08/2005
Application #:
09652580
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
9
Patent #:
6489194
Issue Dt:
12/03/2002
Application #:
09652581
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
10
Patent #:
6479340
Issue Dt:
11/12/2002
Application #:
09652582
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
11
Patent #:
6607975
Issue Dt:
08/19/2003
Application #:
09652583
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
12
Patent #:
6808976
Issue Dt:
10/26/2004
Application #:
09652714
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
13
Patent #:
6720215
Issue Dt:
04/13/2004
Application #:
09652840
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
14
Patent #:
7094657
Issue Dt:
08/22/2006
Application #:
09652841
Filing Dt:
08/31/2000
Title:
METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
15
Patent #:
6916699
Issue Dt:
07/12/2005
Application #:
09652842
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
16
Patent #:
6468854
Issue Dt:
10/22/2002
Application #:
09652920
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
17
Patent #:
6924188
Issue Dt:
08/02/2005
Application #:
09652968
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
18
Patent #:
7049191
Issue Dt:
05/23/2006
Application #:
09652993
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
19
Patent #:
7067861
Issue Dt:
06/27/2006
Application #:
09652994
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
20
Patent #:
6472264
Issue Dt:
10/29/2002
Application #:
09653121
Filing Dt:
08/31/2000
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
21
Patent #:
6518181
Issue Dt:
02/11/2003
Application #:
09815949
Filing Dt:
03/23/2001
Publication #:
US20010042868
Pub Dt:
11/22/2001
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
22
Patent #:
6646456
Issue Dt:
11/11/2003
Application #:
09815964
Filing Dt:
03/23/2001
Publication #:
US20010030552
Pub Dt:
10/18/2001
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
23
Patent #:
6445061
Issue Dt:
09/03/2002
Application #:
09852868
Filing Dt:
05/10/2001
Publication #:
US20010031553
Pub Dt:
10/18/2001
Title:
LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
24
Patent #:
6562182
Issue Dt:
05/13/2003
Application #:
09909579
Filing Dt:
07/20/2001
Publication #:
US20020019067
Pub Dt:
02/14/2002
Title:
METHOD AND APPARATUS FOR ENDPOINTING A CHEMICAL-MECHANICAL PLANARIZATION PROCESS
25
Patent #:
6517668
Issue Dt:
02/11/2003
Application #:
09910356
Filing Dt:
07/20/2001
Publication #:
US20010042596
Pub Dt:
11/22/2001
Title:
METHOD AND APPARATUS FOR ENDPOINTING A CHEMICAL-MECHANICAL PLANARIZATION PROCESS
26
Patent #:
6776871
Issue Dt:
08/17/2004
Application #:
09910661
Filing Dt:
07/20/2001
Publication #:
US20020014310
Pub Dt:
02/07/2002
Title:
METHOD AND APPARATUS FOR ENDPOINTING A CHEMICAL-MECHANICAL PLANARIZATION PROCESS
27
Patent #:
6830961
Issue Dt:
12/14/2004
Application #:
09918739
Filing Dt:
07/31/2001
Publication #:
US20010045629
Pub Dt:
11/29/2001
Title:
METHODS FOR LEADS UNDER CHIP IN CONVENTIONAL IC PACKAGE
28
Patent #:
6897512
Issue Dt:
05/24/2005
Application #:
09981764
Filing Dt:
10/16/2001
Publication #:
US20020025694
Pub Dt:
02/28/2002
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
29
Patent #:
6756301
Issue Dt:
06/29/2004
Application #:
10285552
Filing Dt:
11/01/2002
Publication #:
US20030054632
Pub Dt:
03/20/2003
Title:
METHOD OF FORMING A METAL SEED LAYER FOR SUBSEQUENT PLATING
30
Patent #:
6958528
Issue Dt:
10/25/2005
Application #:
10300300
Filing Dt:
11/19/2002
Publication #:
US20030067059
Pub Dt:
04/10/2003
Title:
LEADS UNDER CHIP IC PACKAGE
31
Patent #:
6781365
Issue Dt:
08/24/2004
Application #:
10428434
Filing Dt:
05/02/2003
Publication #:
US20030183949
Pub Dt:
10/02/2003
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
32
Patent #:
6765398
Issue Dt:
07/20/2004
Application #:
10428703
Filing Dt:
05/02/2003
Publication #:
US20030183521
Pub Dt:
10/02/2003
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
33
Patent #:
6870380
Issue Dt:
03/22/2005
Application #:
10428968
Filing Dt:
05/02/2003
Publication #:
US20030206035
Pub Dt:
11/06/2003
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
34
Patent #:
6972452
Issue Dt:
12/06/2005
Application #:
10805118
Filing Dt:
03/19/2004
Publication #:
US20040175898
Pub Dt:
09/09/2004
Title:
DEVICE AND METHOD FOR PROTECTING AGAINST OXIDATION OF A CONDUCTIVE LAYER IN SAID DEVICE
35
Patent #:
7046029
Issue Dt:
05/16/2006
Application #:
11108603
Filing Dt:
04/18/2005
Publication #:
US20050225340
Pub Dt:
10/13/2005
Title:
CONDUCTIVE MATERIAL FOR INTEGRATED CIRCUIT FABRICATION
36
Patent #:
7084490
Issue Dt:
08/01/2006
Application #:
11185346
Filing Dt:
07/20/2005
Publication #:
US20050248006
Pub Dt:
11/10/2005
Title:
LEADS UNDER CHIP IC PACKAGE
Assignor
1
MICRON TECHNOLOGY, INC.
Exec Dt:
09/26/2008
Assignee
1
APTINA IMAGING CORPORATION
C/O CITICO TRUSTEES (CAYMAN) LIMITED
REGATTA OFFICE PARK, WEST BAY ROAD
GRAND CAYMAN, CAYMAN ISLANDS Y1-1205
Correspondence name and address
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD
MAILDROP A700
PHOENIX, AZ 85008

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