Patent Assignment Details
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Reel/Frame: | 043321/0977 | |
| Pages: | 3 |
| | Recorded: | 08/17/2017 | | |
Attorney Dkt #: | ONS02401US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/07/2020
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Application #:
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15679661
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Filing Dt:
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08/17/2017
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Publication #:
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Pub Dt:
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02/21/2019
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Title:
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MULTI-FACED MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
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Assignee
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5005 E. MCDOWELL ROAD |
MAILDROP A700 |
PHOENIX, ARIZONA 85008 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 E. MCDOWELL ROAD
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MAILDROP A700
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PHOENIX, AZ 85008
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