Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 058354/0977 | |
| Pages: | 5 |
| | Recorded: | 12/10/2021 | | |
| Attorney Dkt #: | M00175.0001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
9
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16296659
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Filing Dt:
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03/08/2019
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Publication #:
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Pub Dt:
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09/10/2020
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Title:
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SEMICONDUCTOR DEVICE HAVING A GLASS SUBSTRATE CORE LAYER
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17406304
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Filing Dt:
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08/19/2021
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Publication #:
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Pub Dt:
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12/09/2021
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Title:
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PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
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Patent #:
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Issue Dt:
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04/23/2024
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Application #:
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17433338
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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05/12/2022
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Title:
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PACKAGING SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING SAME
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Patent #:
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Issue Dt:
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05/14/2024
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Application #:
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17433342
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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LOADING CASSETTE FOR SUBSTRATE INCLUDING GLASS AND SUBSTRATE LOADING METHOD TO WHICH SAME IS APPLIED
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17433347
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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05/26/2022
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Title:
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PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
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Patent #:
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Issue Dt:
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05/16/2023
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Application #:
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17433349
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Filing Dt:
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08/24/2021
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Publication #:
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Pub Dt:
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02/17/2022
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Title:
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PACKAGING SUBSTRATE WITH CORE LAYER AND CAVITY STRUCTURE AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17434906
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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02/24/2022
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Title:
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PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
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Patent #:
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Issue Dt:
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10/11/2022
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Application #:
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17460966
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Filing Dt:
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08/30/2021
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Publication #:
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Pub Dt:
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12/16/2021
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Title:
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PACKAGING SUBSTRATE HAVING ELECTRIC POWER TRANSMITTING ELEMENTS ON NON-CIRCULAR CORE VIA OF CORE VIAS AND SEMICONDUCTOR DEVICE COMPRISING THE SAME
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Patent #:
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Issue Dt:
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09/06/2022
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Application #:
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17462254
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Filing Dt:
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08/31/2021
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Publication #:
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Pub Dt:
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12/23/2021
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Title:
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PACKAGING GLASS SUBSTRATE FOR SEMICONDUCTOR, A PACKAGING SUBSTRATE FOR SEMICONDUCTOR, AND A SEMICONDUCTOR APPARATUS
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Assignee
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| 3000 SKC DRIVE |
| COVINGTON, GEORGIA 30014 |
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Correspondence name and address
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NSIP LAW
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P.O. BOX 65745
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WASHINGTON, DC 20035
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