Patent Assignment Details
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| Reel/Frame: | 062075/0980 | |
| Pages: | 3 |
| | Recorded: | 12/13/2022 | | |
| Attorney Dkt #: | 085728-747326 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18080621
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Filing Dt:
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12/13/2022
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Publication #:
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Pub Dt:
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06/22/2023
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Title:
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DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 222, TECHNO2-RO, YUSEONG-GU |
| DAEJEON, KOREA, REPUBLIC OF 34027 |
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Correspondence name and address
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POLSINELLI
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THREE EMBARCADERO CENTER, SUITE 2400
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SAN FRANCISCO, CA 94111
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05/23/2024 06:57 PM
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