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Patent Assignment Details
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Reel/Frame:013872/0983   Pages: 2
Recorded: 03/10/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10384892
Filing Dt:
03/10/2003
Publication #:
Pub Dt:
09/16/2004
Title:
Wire bonding to full array bonding pads on active circuitry
Assignors
1
Exec Dt:
03/06/2003
2
Exec Dt:
03/06/2003
3
Exec Dt:
03/06/2003
4
Exec Dt:
03/06/2003
Assignee
1
1551 MCCARTHY BOULEVARD
MILPITAS, CALIFORNIA 95035
Correspondence name and address
LSI LOGIC CORPORATION
LEO J. PETERS
MS/D-106
1551 MCCARTHY BLVD.
MILPITAS, CA 95035

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