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Patent Assignment Details

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Reel/Frame:	053786/0986			Pages:	8
		Recorded:	09/16/2020
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 9

Patent #:	NONE	Issue Dt:		Application #:	15927788	Filing Dt:	03/21/2018
Publication #:	US20180354861	Pub Dt:	12/13/2018
Title:	Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Industrial Applications

Patent #:	NONE	Issue Dt:		Application #:	15927940	Filing Dt:	03/21/2018
Publication #:	US20190066980	Pub Dt:	02/28/2019
Title:	Ceramic Material Assembly For Use In Highly Corrosive Or Erosive Semiconductor Processing Applications

Patent #:	NONE	Issue Dt:		Application #:	15984314	Filing Dt:	05/18/2018
Publication #:	US20190366459	Pub Dt:	12/05/2019
Title:	METHOD FOR REPAIRING HEATERS AND CHUCKS USED IN SEMICONDUCTOR PROCESSING

Patent #:	11028021	Issue Dt:	06/08/2021	Application #:	16169938	Filing Dt:	10/24/2018
Publication #:	US20190194078	Pub Dt:	06/27/2019
Title:	Termination Feedthrough Unit With Ceramic Insulator Suitable For Vacuum And Corrosive Applications

Patent #:	10991616	Issue Dt:	04/27/2021	Application #:	16215526	Filing Dt:	12/10/2018
Publication #:	US20200185262	Pub Dt:	06/11/2020
Title:	HIGH SPEED LOW TEMPERATURE METHOD FOR MANUFACTURING AND REPAIRING SEMICONDUCTOR PROCESSING EQUIPMENT AND EQUIPMENT PRODUCED USING SAME

Patent #:	11666993	Issue Dt:	06/06/2023	Application #:	16423626	Filing Dt:	05/28/2019
Publication #:	US20210154776	Pub Dt:	05/27/2021
Title:	Nickel-Carbon And Nickel-Cobalt-Carbon Brazes And Brazing Processes For Joining Ceramics And Metals And Semiconductor Processing And Industrial Equipment Using Same

Patent #:	11331738	Issue Dt:	05/17/2022	Application #:	16677245	Filing Dt:	11/07/2019
Publication #:	US20210086277	Pub Dt:	03/25/2021
Title:	HIGH TEMPERATURE RESISTANT SILICON JOINT FOR THE JOINING OF CERAMICS

Patent #:	11222804	Issue Dt:	01/11/2022	Application #:	16817627	Filing Dt:	03/13/2020
Publication #:	US20200357676	Pub Dt:	11/12/2020
Title:	Electrostatic Chuck For Clamping In High Temperature Semiconductor Processing And Method Of Making Same

Assignor

Exec Dt:

08/07/2020

Assignee

12001 LACKLAND ROAD

ST. LOUIS, MISSOURI 63146

Correspondence name and address
	BURRIS LAW, PLLC
	300 RIVER PLACE DRIVE
	SUITE 1775
	DETROIT, MI 48207

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