Patent Assignment Details
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| Reel/Frame: | 017582/0987 | |
| Pages: | 4 |
| | Recorded: | 02/17/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11357544
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Filing Dt:
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02/17/2006
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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Impedance matching via structure for high-speed printed circuit boards and method of determining same
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Assignee
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| 8000 S. FEDERAL WAY |
| MS 1-525 |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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DAVID J. PAUL
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MICRON TECHNOLOGY, INC.
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MS 1-525
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8000 S. FEDERAL WAY
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BOISE, ID 83716
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