Patent Assignment Details
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| Reel/Frame: | 046096/0992 | |
| Pages: | 6 |
| | Recorded: | 06/15/2018 | | |
| Attorney Dkt #: | TI-78811 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16009377
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Filing Dt:
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06/15/2018
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Publication #:
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Pub Dt:
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12/19/2019
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Title:
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SEMICONDUCTOR STRUCTURE AND METHOD FOR WAFER SCALE CHIP PACKAGE
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Assignee
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| 12500 TI BOULEVARD |
| MS 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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P O BOX 655474, M/S 3999
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DALLAS, TX 75265
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