Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 056250/0993 | |
| Pages: | 7 |
| | Recorded: | 05/14/2021 | | |
Attorney Dkt #: | 28903US02 - 28903US04 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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10/03/2017
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Application #:
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15018668
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Filing Dt:
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02/08/2016
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Publication #:
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Pub Dt:
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08/11/2016
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Title:
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SEMICONDUCTOR PACKAGE USING A CORELESS SIGNAL DISTRIBUTION STRUCTURE
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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15689714
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Filing Dt:
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08/29/2017
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Publication #:
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Pub Dt:
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12/14/2017
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Title:
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Semiconductor Package Using A Coreless Signal Distribution Structure
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Patent #:
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Issue Dt:
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10/18/2022
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Application #:
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17156788
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Filing Dt:
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01/25/2021
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Publication #:
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Pub Dt:
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07/15/2021
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Title:
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Semiconductor Package Using A Coreless Signal Distribution Structure
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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