Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 061577/0994 | |
| Pages: | 2 |
| | Recorded: | 09/30/2022 | | |
| Attorney Dkt #: | 5750/0567PUS1 |
| Conveyance: | PARTIAL ASSIGNMENT |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/28/2023
|
Application #:
|
16274477
|
Filing Dt:
|
02/13/2019
|
|
Publication #:
|
|
Pub Dt:
|
06/11/2020
| | | | |
|
Title:
|
WAFER LEVEL ULTRASONIC CHIP MODULE AND MANUFACTURING METHOD THEREOF
|
|
|
Assignee
|
|
|
|
|
| ROOM 301, BUILDING 5, HANWEI IOT TECHNOLOGY INDUSTRIAL PARK, NO.32 WUTONG STREET |
| ZHENGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
| ZHENGZHOU, HENAN PROVINCE, CHINA |
|
|
Correspondence name and address
|
| |
MUNCY, GEISSLER, OLDS & LOWE, PC
|
| |
4000 LEGATO RD., SUITE 310
|
| |
FAIRFAX, VA 22033
|
Search Results as of:
06/04/2024 05:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
