Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2018
|
Application #:
|
15316285
|
Filing Dt:
|
12/05/2016
|
|
Publication #:
|
|
Pub Dt:
|
06/29/2017
| | | | |
|
Inventors:
|
Atsushi SEIKI, Atsushi KAWANO, Kenichi MATSUMURA, Norikazu MASHINO, Kei YOSHIYAMA
|
|
Title:
|
RESIN COMPOSITION FOR MOLDING USE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 530-0047 |
|
|
|
| 4-4, NISHITEMMA 2-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 530-0047 |
|
|
|
|
| WENDEROTH, LIND & PONACK, L.L.P. |
| 1030 15TH STREET, NW |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
|
|
Search Results as of:
04/30/2024 10:54 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
