Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
06/26/2018
|
Application #:
|
15357553
|
Filing Dt:
|
11/21/2016
|
Publication #:
|
|
Pub Dt:
|
03/09/2017
| | | | |
Inventors:
|
Rajesh Katkar, Tu Tam Vu, Bongsub Lee, Kyong-Mo Bang, Xuan Li, Long Huynh et al
|
Title:
|
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIBUTION LAYER
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
|
|
|
TESSERA INTELLECTUAL PROPERTIES CORP. |
3025 ORCHARD PARKWAY |
SAN JOSE, CA 95134 |
|
|
Assignment:
2
|
|
|
|
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
101 NORTH TRYON STREET |
CHARLOTTE, NORTH CAROLINA 28255 |
|
|
|
STEWART WALSH |
1025 VERMONT AVE NW, SUITE 1130 |
COGENCY GLOBAL INC. |
WASHINGTON, DC 20005 |
|
|
Search Results as of:
05/09/2024 02:05 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|